COPPER FOIL 99% EXTRA PURE

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MOQ : 1 Kilograms

COPPER FOIL 99% EXTRA PURE Specification

HS Code
74091100

Poisonous
NO

Physical Form
Foil

EINECS No
231-159-6

Melting Point
1085C

Molecular Weight
63.55 g/mol

Usage
Ideal for conductive substrates printed circuit boards and heat dissipation mechanisms

Shelf Life
Indefinite when stored properly

Shape
Flat sheet or roll

Ingredients
Copper - 99% extra pure

Structural Formula
Cu

Molecular Formula
Cu

Application
Used in electronics batteries electromagnetic shielding and industrial applications

CAS No
7440-50-8

Smell
Odorless

Grade
Industrial Grade

Storage
Store in a dry cool place away from moisture and corrosive materials

Purity
99%

Properties
High conductivity corrosion resistance and malleability

Solubility
Insoluble in water

Appearance
Shiny metallic foil

Density
8.96 Gram per cubic centimeter(g/cm3)

About COPPER FOIL 99% EXTRA PURE

COPPER FOIL 99% EXTRA PURE is a versatile and high-quality product used in various industries such as electronics, batteries, electromagnetic shielding, and more. This industrial-grade copper foil is known for its high conductivity, corrosion resistance, and malleability, making it ideal for applications like conductive substrates, printed circuit boards, and heat dissipation mechanisms. With a purity of 99%, this shiny metallic foil in flat sheet or roll form ensures top-notch performance. The foil is non-poisonous, odorless, and easily stored in dry, cool places, away from moisture and corrosive materials. With a density of 8.96 g/cm3 and a melting point of 1085C, this copper foil is a reliable and essential material for various industrial purposes.

FAQs of COPPER FOIL 99% EXTRA PURE:

Q: What are the key features of COPPER FOIL 99% EXTRA PURE?

A: COPPER FOIL 99% EXTRA PURE is known for its high conductivity, corrosion resistance, and malleability, making it perfect for various industrial applications.

Q: Where can I use this copper foil?

A: This foil is ideal for use in electronics, batteries, electromagnetic shielding, conductive substrates, printed circuit boards, and heat dissipation mechanisms.